Новые продукты для 8layer BGA Ассамблеи

Новые продукты для 8layer BGA Ассамблеи

We have the capacity to manufacure the 8-Layer BGA Assembly,and ensure the good quality under customer's requirements.

New product for 8layer BGA Assembly

PCB:

FR4 1.2mm thickness

ENIG 1-3u"

copper: 1.5oz/1oz/1oz/1.5oz

PCBA:

BGA IC : TI

BGA space: 0.4mm