Новые продукты для 8layer BGA Ассамблеи
- доля
- Источник
- K.F. International Limited
- Издатели
- Cindy
- Время выпуска
- 2013/1/15
We have the capacity to manufacure the 8-Layer BGA Assembly,and ensure the good quality under customer's requirements.
New product for 8layer BGA Assembly
PCB:
FR4 1.2mm thickness
ENIG 1-3u"
copper: 1.5oz/1oz/1oz/1.5oz
PCBA:
BGA IC : TI
BGA space: 0.4mm
